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Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, wh...
Citation: Micro and Nano Systems Letters 2013 1:3
Existing models for thermoelastic damping consider geometric size effects only, the focus of this study is on tuning of thermoelastic damping with mechanical strain, which reduces both relaxation rate and ther...
Citation: Micro and Nano Systems Letters 2013 1:2
In this paper, a simple and robust model is presented to explain the main reason behind undercutting at convex corners and no-undercutting at concave corners. The etch rate of the tangent plane at convex corne...
Citation: Micro and Nano Systems Letters 2013 1:1
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