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  1. Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, wh...

    Authors: Masayoshi Esashi and Shuji Tanaka

    Citation: Micro and Nano Systems Letters 2013 1:3

    Content type: Review

    Published on: