From: Silicon nanoparticles: fabrication, characterization, application and perspectives
Method | Â | Size range | Uniformity |
---|---|---|---|
Top-down | Etching and grinding | 100–400 nm | Low |
Laser ablation | Larger than several nm | Low | |
Laser printing | 160–400 nm | High | |
Bottom-up | Pyrolysis of silane | Larger than 10 nm | Low |
Reduction of silicon tetrachlorid | Larger than 10 nm | Low | |
Reduction of silica particles | Carbothermal reduction | 80–200 nm | Low |
Magnesiothermic reduction | 10–350 nm | Low |