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Micro and Nano Systems Letters
Fig. 1 | Micro and Nano Systems Letters

Fig. 1

From: Investigation of LIG-based pressure sensors with various silicon-based elastomeric encapsulation layers

Fig. 1

Steps for fabricating LIG-based pressure sensor. i The formation of a metal electrode on the polyimide. ii The formation of LIG using a CO2. iii The silver-paste soldering between the metal and LIG. iv The encapsulation of the device using various elastomers (PDMS 5:1, 10:1, 20:1, and Ecoflex 1:1) via spin coating. v The bubble elimination in vacuum. vi The curing of the elastomer. (vii) The connection between pad and wire using Pb solder. viii Pressure measurements of sensors

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