Fig. 4
From: Overcoming delamination in two-photon lithography for improving fabrication of 3D microstructures
SEM images showing correlation between delamination occurrence for different designs and different process conditions. a Delamination for different stacking areas (l) at the same thickness. (l1 = 4, l2 = 8, l3 = 12, l4 = 16, l5 = 20, and l6 = 24 µm) b Delamination for different thicknesses (t) at the same length (l = 12 µm). (t1 = 1, t2 = 2, t3 = 3, t4 = 4, t5 = 5, t6 = 6, and t7 = 7 µm). Red circles indicate the region of delamination