Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma

Park, Jin Soo; Kang, Dong-Hyun; Kwak, Seung Min; Kim, Tae Song; Park, Jung Ho; Kim, Tae Geun; Baek, Seung-Hyub; Lee, Byung Chul

doi:10.1186/s40486-020-00116-x

Micro and Nano Systems Letters

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Last updated: Fri, 26 Apr 2024 16:17:12 Z

Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF₆ plasma

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