Fig. 6From: Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasmaCross-sectional SEM images of DRIE trench smoothened using the optimized RIE condition of 100 W RF power and 30 sccm SF6 flow for 30 min. Cross-sectional SEM images of the sidewall (a) near the top and (b) at the bottom of the trench. All scale bars in SEM images are 1 μmBack to article page