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Fig. 3 | Micro and Nano Systems Letters

Fig. 3

From: Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma

Fig. 3

Scallop smoothing results after varying the RF power during the RIE process. a Average scallop depths of trenches as a function of each RF power condition. As-is DRIE represents the trench before scallop smoothing. The error bar under each condition represents the standard error of 5 averaged scallop depths. SEM images of sidewalls (b) near the top area and (c) at the bottom of the trenches for each RF power value. All scale bars in SEM images are 1 μm

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