Fig. 3From: Wet anisotropic etching characteristics of Si{111} in NaOH-based solution for silicon bulk micromachiningSchematic demonstration of the wet anisotropically etched profiles of various shapes mask geometries on Si{111} wafer: a mask patterns, b etched profiles after etching in wet anisotropic etchants, and c cross sectional view along different directions. Dashed lines in a show the directions where wet etching will terminate due to the appearance of {111} planesBack to article page