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Table 3 Comparison of the area reduction ratio for a 1.6 μm-diameter hole array etched with a standard DRIE recipe and a 1.3 μm-diameter hole array etched with an optimized recipe

From: Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio

 

Standard DRIE recipe (A\(_{1}\))

Optimized DRIE recipe (A\(_{2}\))

Improvement (A\(_{1}\)-A\(_{2}\))

Area reduction ratio (%)

91

21

70