From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
Authors | Additive’s name | Orientation of Si | KOH Conc | Temp. (°C) | Effect on surface roughness |
---|---|---|---|---|---|
C. Moldovan et al. [52] | Redox + complexant | {100} | 4.5 M | 80 | Not reported |
C-R Yang et al. [56] | Anionic sodium dihexyl sulfosuccinate (SDSS) | {100} | 30 wt% | 60–100 | Not reported |
R. Sotoaka [55] | Maltose, Glucose, NH2OH, Cellobiose | {100} | 25 wt% | 80 | Not reported |
NH2OH | {100}, {110} and {111} | 20 wt% | 75 | Significant increase |