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Table 7 The effect of various kinds of additives on the undercutting at convex corners in KOH solution

From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review

Authors

Additive’s name

Orientation of Si

KOH Conc

Temp. (°C)

Effect on surface roughness

C. Moldovan et al. [52]

Redox + complexant

{100}

4.5 M

80

Not reported

C-R Yang et al. [56]

Anionic sodium dihexyl sulfosuccinate (SDSS)

{100}

30 wt%

60–100

Not reported

R. Sotoaka [55]

Maltose, Glucose, NH2OH, Cellobiose

{100}

25 wt%

80

Not reported

A. V. Narasimha Rao et al. [51, 63,64,65]

NH2OH

{100}, {110} and {111}

20 wt%

75

Significant increase