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Table 2 The effect of various kinds of additives on the etch rate of silicon in TMAH solution

From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review

Authors

Additive that improves the etch rate

Orientation of silicon

TMAH Conc

Temp. (°C)

Etch rate

C-R Yang et al. [56]

Anionic sodium dihexyl sulfosuccinate (SDSS)

{100}

10 wt.%

60–100

Mild increase at 90 and 100 C

G Yan et al. [106]

Ammonium persulfate (AP)

{100}

5, 10 wt%

85

Effective increase

N Fujitsuka et al. [108]

Ammonium persulfate (AP)

{100}

10 wt.%

80

Effective increase

K-H Jun et al. [109]

Pyrazine, Ammonium persulfate (AP)

{100}

10 wt%

70

Effective increase

S. Birda et al. [107]

Ammonium persulfate (AP)

{100}

5–10 wt.%

70–90

Effective increase

E.H. Klaassen et al. [111]

Ammonium peroxydisulfate

{100}

5 wt.%

70–100

Effective increase

R. Sotoaka [55]

Maltose, Glucose, NH2OH, Cellobiose

{100}

10 wt%

80

Significant increase in NH2OH added solution

V. Swarnalatha et al.[50, 60,61,62]

NH2OH

{100}, {110} and {111}

5 wt%

70

Significant increase