Table 1 Wafer size vs thickness
From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
Wafer size | Standard thickness |
|---|---|
2 inch (50.8 mm) | 275 µm |
76 mm (3 inch) | 375 µm |
100 mm (4 inch) | 525 µm |
125 mm (5 inch) | 625 µm |
150 mm (6 inch) | 675 µm |
200 mm (8 inch) | 725 µm |
300 mm (12 inch) | 775 µm |
450 mm (18 inch), future | 925 µm |