Fig. 63
From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
Undercutting with varying etchant age on a Si{100}, b Si{110} ((i) acute corner and (ii) obtuse corner) and c Si{111} in 5 wt% TMAH + 10% NH2OH at 70 ± 1 °C [50]