Fig. 35
From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
SEM micrographs and average roughness of etched surfaces in pure and SDSS-added 30 wt% KOH and 10 wt% TMAH at 90 °C: a pure KOH, b KOH + SDSS, c pure TMAH, d TMAH + SDSS [56], © 2005, Elsevier