Fig. 31
From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
Effect of aging of 15% NH2OH + 20 wt% KOH on the etch rates of (a) Si{100}, (b) Si{110}, and (c) Si{111} at 75 ± 1 °C [51]
Fig. 31 | Micro and Nano Systems Letters