Fig. 30
From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
Effect of aging of 10% NH2OH + 5 wt% TMAH on the etch rates of (a) Si{100}, (b) Si{110}, and (c) Si{111} at 70 ± 1 °C [50]
Fig. 30 | Micro and Nano Systems Letters