Fig. 24From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a reviewEtch rate of aluminium as a function of (NH4)2S2O8 concentration at 85 °C. The amount of dissolved silicon in 5 and 10 wt % TMAH are 1.6 and 3.2 wt%, respectively [106], © 2001, ElsevierBack to article page