Fig. 22From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a reviewEtch rate of Si{100} in 4.5 M KOH with a redox (K3[Fe(CN)6] 0.1 M, K4[Fe(CN)6].3H2O 0.1 M, KNO3 0.1 M) and b complexants (ether-crown, calix[4]arenes) [52], © 1999, ElsevierBack to article page