Fig. 10From: High speed silicon wet anisotropic etching for applications in bulk micromachining: a reviewSEM images of Si{100} surface etched in 5 wt% TMAH under three different agitation conditions: a Sample A: without agitation, b Sample B: with rotational stirrer agitation, and c Sample C: with ultrasonic agitation of 300 W [66], © 2002, ElsevierBack to article page