Fig. 7From: Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasmaOptical top view images of the opening trenches (a) before and (b) after the scallop smoothing RIE. Cross-sectional SEM images at the bottom of the trenches (c) before and (d) after scallop smoothing RIE for 30 minBack to article page