From: Optical MEMS devices for compact 3D surface imaging cameras
3D imaging principle | Size | Working distance | Speed | Miniaturized system application | Author (year), Journal (refs.) |
---|---|---|---|---|---|
Stereoscopic vision (multiple view from 7 LC lens) | Device size: 1.4 mm in diameter Packaging size: 3.5 mm in diameter (endoscopy) | Focal lengths from 25 to 240 mm | – | Focus-tunable endoscopy | Hassanfiroozi et al. [27], Optics Express |
Stereoscopic vision (multiple view from 3 LC lens) | Device size: 1.42Â mm in diameter Packaging size: 2.5Â mm in diameter (endoscopy) | Focal lengths from 80Â mm to infinity | 2D/3D switching time: 1.5Â s | 2D/3D switchable and focus-tunable endoscopy | Hassanfiroozi et al. [28], Optics Express |
Stereoscopic vision (temporal division) | Device size: 3.4 mm × 3.3 mm × 1 mm | 3D demonstrated from 65 to 120 mm in distance | Actuating frequency: 136 Hz | – | Jang et al. [29], Optics Express |
Stereoscopic vision (split by refraction) | Device size: 5 mm × 5 mm | 3D demonstrated from 10 to 100 mm in distance | – | 3D endoscopy | Yang et al. [30], Optics Letters |
Structured light (MEMS mirror immersed in oil) | Device size: 3.2 mm × 3.2 mm | 3D demonstrated at entire 30 in | Actuating frequency: up to 70 Hz | – | Zhang et al. [31], Optics Express |
Structured light (combination with MEMS mirror and diffractive structure) | Device size: 1 mm in diameter | Structured light projected at 30 cm, 50 cm distance | MEMS mirror actuating frequency: 25.5 kHz/camera framerate: 30 fps | – | Carpignano et al. [32], J. Disp. Tech. Merlo et al. [33], IEEE_ |
Structured light (variable light patterns) | Device size: 1.2 mm × 1.2 mm × 0.43 mm | – | Actuating frequency: fx 5950–6006 Hz fy 6800–6798 Hz | – | Seo et al. [34], IEEE OMN 2018 |
Stereoscopic with structured light (64 × 64 Dammann grating) | Packaging size: 170 g weigh with 14 cm width | Measuring distance at 150 mm | Camera framerate: up to 15 fps | Handily scannable module | Wei et al. [36], Applied Optics |
Structured light (designed transmission DOE and patterned VCSEL array) | Device size: adjustable by glass wafer cutting | – | – | – | Lyu et al. [37], SPIE Optical Design and Engineering VII |
Structured light (diffractive lens, beam shaper, and Damman beam splitter combined DOE) | – | Measuring distance at 1 m | – | – | Barlev et al. [38], Optics Express |
Time-of-flight (2-axis scanning MEMS based laser scanning) | Sensor chip size: 8 mm × 5 mm | Measured distance range up to 20 m | Frame rate: 10 fps | LIDAR system | Niclass et al. [39], Optics Express |
Time-of-flight (optical shutter with multi-layered optical resonance cavity and electro-absorptive layers) | Device size: 7.3 mm × 5.5 mm | 3D demonstrated from 1 to 3 m in distance | Optical shutter modulation frequency: 20 MHz | – | Park et al. [40], SPIE MOEMS-MEMS 2012 Park et al. [41], SPIE MOEMS-MEMS 2014 |