Table 2 Comparison of bonding properties for the cavity patterns
From: Fracture analysis of anodically bonded silicon substrates during the CMP process
| Â | Sample 1 | Sample 2 | Sample 3 | Sample 4 |
|---|---|---|---|---|
Area of glass pillar (mm2) | 2.8 | 3.1 | 3.5 | 8.6 |
Bonding area rate (%) | 7.0 | 7.8 | 8.6 | 21.2 |
Maximum von Mises stress (MPa) | 89.50 | 1.58 | 9.27 | 0.3 |
Occurrence of fractures | Yes | No | No | No |