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Micro and Nano Systems Letters

Table 1 The mechanical properties of the materials composing diaphragm

From: MEMS capacitive pressure sensor monolithically integrated with CMOS readout circuit by using post CMOS processes

Material

Thickness (μm)

Young’s modulus (GPa)

Poisson’s ratio

SiO2

0.85

69

0.17

Aluminum

0.7

70

0.3

Parylene

1.5

3.2

0.4

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