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Micro and Nano Systems Letters
Figure 51 | Micro and Nano Systems Letters

Figure 51

From: A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching

Figure 51

Fabrication steps for the formation of microfluidic channels with multiple reservoirs with perfect convex corners: (a) Si 3 N 4 deposited wafer; (b) Patterning of Si 3 N 4 layer using mask # 1; (c) Thermal oxidation followed by patterning of oxide layer using mask # 2 (d) Anisotropic etching in surfactant added TMAH (or IPA added KOH) (e) Re-oxidation followed by selective removal of Si 3 N 4 (f) Again anisotropic etching in pure TMAH (or KOH) and removal of oxide layer.

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