Figure 35From: A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching SEM pictures of mesa structures fabricated in (a) 30 wt% KOH at 80°C (Courtesy of Dr. W. Fan, work done at Peking University) and (b) 25 wt% TMAH at 70°C using superimposed squares as compensating pattern. Back to article page