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Micro and Nano Systems Letters
Figure 1 | Micro and Nano Systems Letters

Figure 1

From: Fabrication of a 3 dimensional dielectrophoresis electrode by a metal inkjet printing method

Figure 1

The process of DEP chip fabrication. (a) Au planar electrode fabrication with lift-off process and Cr/Au thermal evaporation. (b) AZ 4330 PR patterning on the Au electrode surface where the Ag will be printed. (c) Fluorocarbon (FC) coating on the surface and sintering. (d) Removing AZ 4330 PR on the Au electrode. (e) Printing Ag inkjet on the Au electrode surface where FC is not coated. (f) Bonding with PDMS chamber.

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