TY - JOUR AU - Esashi, M. PY - 2008 DA - 2008// TI - Wafer level packaging of MEMS JO - J of Micromechanics and Microengineering VL - 18 UR - https://doi.org/10.1088/0960-1317/18/7/073001 DO - 10.1088/0960-1317/18/7/073001 ID - Esashi2008 ER - TY - BOOK AU - Yamamoto, M. AU - Hayama, H. AU - Enomoto, T. PY - 1984 DA - 1984// TI - Promissing new fabrication process developed for stacked LSI’s PB - Proc. The IEEE Intnal. Electron Devices Meeting CY - San Francisco ID - Yamamoto1984 ER - TY - JOUR AU - Niklaus, F. AU - Stemme, G. AU - Lu, J. -. Q. AU - Gutmann, R. L. PY - 2006 DA - 2006// TI - Adhesive wafer bonding JO - J. of Applied Physics VL - 99 UR - https://doi.org/10.1063/1.2168512 DO - 10.1063/1.2168512 ID - Niklaus2006 ER - TY - JOUR AU - Lapisa, M. AU - Stemme, G. AU - Niklaus, F. PY - 2011 DA - 2011// TI - Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS JO - IEEE J of Selected Topics in Quqntum Electronics VL - 17 UR - https://doi.org/10.1109/JSTQE.2010.2093570 DO - 10.1109/JSTQE.2010.2093570 ID - Lapisa2011 ER - TY - JOUR AU - Niklaus, F. AU - Enoksson, P. AU - Griss, P. AU - Kälvesten, E. AU - Stemme, G. PY - 2001 DA - 2001// TI - Low-temperature wafer-level transfer bonding JO - IEEE J of Microelectromechanical Systems VL - 10 UR - https://doi.org/10.1109/84.967375 DO - 10.1109/84.967375 ID - Niklaus2001 ER - TY - JOUR AU - Zimmer, F. AU - Lapisa, M. AU - Bakke, T. AU - Bring, M. AU - Stemme, G. PY - 2011 DA - 2011// TI - One-megapixel monocrystalline-silicon micromirror array on CMOS driving electronics manufactured with very large-scale heterogeneous integration JO - IEEE J of Microelectromechanical Systems VL - 20 UR - https://doi.org/10.1109/JMEMS.2011.2127454 DO - 10.1109/JMEMS.2011.2127454 ID - Zimmer2011 ER - TY - BOOK AU - Kochhar, A. AU - Matsumura, T. AU - Zhang, G. AU - Pokharel, R. AU - Hashimoto, K. AU - Esashi, M. AU - Tanaka, S. PY - 2012 DA - 2012// TI - Monolithic fabrication of film bulk acoustic resonators above integrated circuit by adhesive-bonding-based film transfer PB - 2012 IEEE Ultrasonics Symposium CY - Dresden ID - Kochhar2012 ER - TY - BOOK AU - Matsuo, K. AU - Moriyama, M. AU - Esashi, M. AU - Tanaka, S. PY - 2012 DA - 2012// TI - Low-voltage PZT-actuated MEMS switch monolithically integrated with CMOS circuit PB - Tech Digest IEEE MEMS 2012 CY - Paris ID - Matsuo2012 ER - TY - JOUR AU - Niklaus, F. AU - Kälvesten, E. AU - Stemme, G. PY - 2001 DA - 2001// TI - Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays JO - J of Micromechanics Microengineering VL - 11 UR - https://doi.org/10.1088/0960-1317/11/5/310 DO - 10.1088/0960-1317/11/5/310 ID - Niklaus2001 ER - TY - JOUR AU - Makihata, M. AU - Tanaka, S. AU - Muroyama, M. AU - Matsuzaki, S. AU - Yamada, H. AU - Nakayama, T. AU - Yamaguchi, U. AU - Mima, K. AU - Nonomura, Y. AU - Fujiyoshi, M. AU - Esashi, M. PY - 2012 DA - 2012// TI - Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection JO - Sensors and Actuators A VL - 188 UR - https://doi.org/10.1016/j.sna.2012.04.032 DO - 10.1016/j.sna.2012.04.032 ID - Makihata2012 ER - TY - BOOK AU - Seeger, J. AU - Lim, M. AU - Nasiri, S. PY - 2010 DA - 2010// TI - Development of high-performance, high-volume consumer MEMS gyroscopes, Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head Island PB - Transducer Research Foundation CY - California, USA ID - Seeger2010 ER - TY - JOUR AU - Dospont, M. AU - Drechsler, U. AU - Yu, R. AU - Pogge, H. R. AU - Vettiger, P. PY - 2004 DA - 2004// TI - Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system JO - IEEE J of Microelectromechanical Systems VL - 13 UR - https://doi.org/10.1109/JMEMS.2004.835769 DO - 10.1109/JMEMS.2004.835769 ID - Dospont2004 ER - TY - JOUR AU - Ikegami, N. AU - Yoshida, T. AU - Kojima, A. AU - Ohyi, H. AU - Koshida, N. AU - Esashi, M. PY - 2012 DA - 2012// TI - Active-matrix nanocrystalline Si electron emitter array for massively parallel direct-write electron-beam system: first results of the performance evaluation JO - J Micro/Nanolith VL - 11 UR - https://doi.org/10.1117/1.JMM.11.3.031406 DO - 10.1117/1.JMM.11.3.031406 ID - Ikegami2012 ER - TY - BOOK AU - Nishino, H. AU - Yoshida, S. AU - Tanaka, S. AU - Esashi, M. AU - Kojima, A. AU - Ikegami, N. AU - Koshida, N. PY - 2013 DA - 2013// TI - Primary study of fabrication process of LSI-integrated Pierce-type surface-electron-emitter array for massive parallel lithography PB - H25 Convention of IEEJ CY - Nagoya ID - Nishino2013 ER - TY - JOUR AU - Guerre, R. AU - Drechsler, U. AU - Jubin, D. AU - Despont, M. PY - 2008 DA - 2008// TI - Selective transfer technology for microdevice distribution JO - IEEE J of Microelectromechanical Systems VL - 17 UR - https://doi.org/10.1109/JMEMS.2007.911370 DO - 10.1109/JMEMS.2007.911370 ID - Guerre2008 ER - TY - BOOK AU - Tanaka, S. AU - Yoshida, M. AU - Hirano, H. AU - Somekawa, T. AU - Fujita, M. AU - Esashi, M. PY - 2013 DA - 2013// TI - Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test PB - Technical Digest IEEE MEMS 2013 CY - Taipei ID - Tanaka2013 ER - TY - BOOK AU - Tanaka, S. AU - Yoshida, M. AU - Hirano, H. AU - Esashi, M. PY - 2012 DA - 2012// TI - Lithium niobate SAW device hetero-transferred onto silicon integrated circuit using elastic and sticky bumps, 2012 PB - IEEE International Ultrasonics Symposium CY - Dresden, Germany ID - Tanaka2012 ER - TY - JOUR AU - Yoshida, S. AU - Yanagida, H. AU - Esashi, M. AU - Tanaka, S. PY - 2013 DA - 2013// TI - Simple removal technology of chemically stable polymer in MEMS using ozone solution JO - J Microelectromechanical Systems VL - 22 UR - https://doi.org/10.1109/JMEMS.2012.2217374 DO - 10.1109/JMEMS.2012.2217374 ID - Yoshida2013 ER -